News - history

TMC project mid-term meeting

On 24. September 2003, TMC project mid-term meeting went on. More details about TMC project can be found here.

New releases of T-SIM / B-SIM - 3.9.2003

New versions of T-SIM and B-SIM are available for download. Registered users can download the full installation package in the User support section. See the list of new versions' features here.

TMC project "kickoff" meeting

On 24. September 2002, TMC project "kickoff" went on. TMC (Thermoforming Material Characterization) project, founded by EU, is focussed on development of a cheap and reliable method of material testing for thermoforming and blow molding. Several companies, including Accuform, IKP Stuttgart and Jacob Kunststofftechnik, are involved. More details can be found here.


19.2.2003

New discussion phorum, now accesible for everybody, not just for our registered users. You are invited to send your posts with questions and remarks. Moreover, the phorum is continuosly filled with information about Accuform software and about progress in development of T-SIM and B-SIM. Do not hesitate and enter the phorum here...

New address - 20.12.2002

Accuform was moved to a new location:

Accuform Jetelova 582 ZLIN-STIPA 763 14 Czech Republic

Tel / fax: (+420) 577 210 465 E-mail: info@t-sim.com or info@b-sim.com WWW: www.t-sim.com or www.b-sim.com

New releases of T-SIM / B-SIM - 13.11.2002

T-SIM Version 4.4 and B-SIM Version 2.4 has been just released. Registered users can download the full installation package in the User support section. What's new in these versions? See the list of new features here.

TMC project "kickoff" meeting

On 24. September 2002, TMC project "kickoff" went on. TMC (Thermoforming Material Characterization) project, founded by EU, is focussed on development of a cheap and reliable method of material testing for thermoforming and blow molding. Several companies, including Accuform, IKP Stuttgart and Jacob Kunststofftechnik, are involved. More details can be found here.

New releases of T-SIM / B-SIM - 22.8.2002

T-SIM Version 4.35 and B-SIM Version 2.35 has been just released. Registered users can download the full installation package in the User support section.

Both T-SIM and B-SIM are now capable to run on network. For details about network licenses and their prices, please contact Accuform or your local representative.

B-SIM now includes an advanced extrusion control, used in extrusion blow molding simulation. This means that B-SIM is capable to simulate also the extrusion phase of extrusion blow molding process. Details can be found in B-SIM Reference.

New discussion forum

Starting from 11. July 2002, every user of Accuform software can use our new discussion forum. Just log in at www.t-sim.com/users.

Web site

Starting from 15. April 2002, new user section is available for existing T-SIM and B-SIM users. Check it here.

New releases of T-SIM & B-SIM - 15.3.2002

New versions (T-SIM 4.32, B-SIM 2.32) were released. Existing users can download the upgrade here.

Improvements and new features in these versions:

1) Much faster contact detection enables solution of complex projects with 50000 elements on sheet and 150000 elements on tool in 1 hour 20 minutes (Athlon 1.5 GHz).
2) Calculation of weight of a selected area of parison / preform / sheet. For details see B-SIM Reference or T-SIM Reference.
3) Tool cut - this simple feature enables to remove faces from tools.

12.2.2002 - Accuform celebrates 10 years of its existence !!!

18.1.2002 - New design of our web site

Our web sites www.t-sim.com and www.b-sim.com have new design.

New releases of T-SIM & B-SIM - 14.1.2002

New versions of T-SIM Version 4.31 and B-SIM Version 2.31 has been released. Existing users can download the upgrade here.

T-SIM & B-SIM Demo download - 10.8.2001

T-SIM & B-SIM Demo can be now downloaded from our Download page.

Exhibitions, conferences, events:

BRASILPLAST 2005 4 A 8 DE ABRIL ANHEMBI - SP Visit our Brasil representative (company Ank Eng, Mr. Kin Ng Pui) at booth E37. See also the official web site.

K2004 October 20-27, 2004 Duesseldorf, Germany Accuform exhibited its simulation software at the booth of CIFRA, Hall 3, Stand C92-2. See also K2004 web site.

 

Euromold, 3. - 6. December 2003 Messegelände . Exhibition Center Frankfurt/Main, Germany For more information see Euromold web page.

4th European Thermoforming Conference, Viareggio, Italy, March 25-27, 2004 For more details about the conference, visit the European Thermoforming Division web site at www.e-t-d.org.

SPE Thermoforming Conference, Cincinnati, Ohio, September 13-16, 2003 Accuform will be there, exhibiting its latest T-SIM at the booth of our North American representative, company Compuplast Canada. For more details about the conference, visit the SPE web site.

The World's Plastics Showcase, June 23-27, 2003, McCormick Place, Chicago, Illinois USA Compulast, Accuform's representative for North America and Canada, exhibited on NPE 2003.

PLAST03, Plastic exhibition in Milano, May 6-10, 2003 Our representative for Italy (GAMBIT s.r.l.) exhibited there our software T-SIM and B-SIM. More details: http://www.plast03.org/?Cambia=ing

Euromold 2002, Frankfurt/Main, Germany, 4th to 7th December, 2002 Euromold 2002, Frankfurt/Main, Germany, 4th to 7th December, 2002 Company CADFEM, representing Accuform's products in Germany, will exhibit our software on Euromold 2002. Visit hall 9.2, stand E38 to meet Mr. Joscha Sehnert, who can answer your questions about T-SIM and B-SIM.

Meeting of representatives Prague, Czech Republic, January 10-13, 2002 The meeting will be held at the Green Garden hotel, which is relatively close to Wenceslas Square. Friday Jan 10 - Arrival of Representatives Saturday Jan 11 - New developments Sunday Jan 12 - Sales and marketing Monday Jan 13 - Future Developments and Wish List Optional "Hands-On" Training in Zlin: Representatives are invited for advanced, "Hands On" simulation training sessions at the Compuplast or Accuform Offices in Zlin on Tuesday, Wednesday and Thursday following the meeting in Prague.

Thermoformen technisher Bauteile, Wuerzburg,Germany,November 27-28, 2002 (in German language, organized by SKZ) Mr. Bernhard Hegemann from IKP Stuttgart presented a paper "TMC - Thermoform Material Characterisierung (Thermoforming Material Characterization)" (27. November 2002, 17:10). The TCM project, founded by EU, aims to develop a simple, reliable and cheap method of material characterization to provide thermoforming industry with a testing procedure to evaluate material behavior and to obtain viscoelastic material data for thermoforming simulation. Link to SKZ web site: www.skz.de

 

20. CAD-FEM Users' Meeting, Friedrichshafen, Germany, October 9 - 11, 2002   CAD-FEM company is Accuform's representative in Germany. On Friday, October 11, 2002, Dr. Karel Kouba from Accuform presented the latest news and advances in T-SIM and B-SIM development. For more details, see the agenda of October 11,2002. See also the whole program of CAD-FEM users' meeting.

Interplast 2002, NEC, Birmingham, UK, September 30 - October 04, 2002 Accuform exhibited its software at the booth of Porpoise company. For more details, visit the official Interplas2002 web site.

SPE Thermoforming Conference, Nashville, Tennessee, September 14-17, 2002 Anybody involved in thermoforming cannot afford to miss this event. Accuform was there too, exhibiting its latest T-SIM at the booth of our North American representative, company Compuplast International. Tom Bush from Fabri-Kal Corporation talked in his presentation about Fabri-Kal experiences with T-SIM computer simulation of plug assist thermoformed parts. You can download his presentation here (~ 7 MBytes WinZip file). For more details about the conference, visit the SPE web site.

Antec 2002 - San Francisco, CA, May 5-9, 2002 Accuform was there exhibiting T-SIM & B-SIM at the booth of our North American representative, company Compuplast International. (Antec 2002 booth photo) Mr. Bernhard Hegemann from IKP Germany presented a paper "Process simulation modeling parameters for plug assisted thermoforming of high density polyethylene" (Monday, May 6, Section M27, 2:30PM) For more details about the conference, see the SPE web site.

3rd European Thermoforming Conference March 23 - 25, 2002, Zurich, Switzerland Accuform was there exhibiting T-SIM, software package for simulation of thermoforming. Mr. Bernhard Hegemann from IKP presented a paper "Improving our Industry through Technical Developments", dealing with a new testing method enabling easy material quality control at thermoforming companies. For more details about the conference, see the new European thermoforming division web site. Abstract: B. Hegemann, Improving our Industry through Technical Developments Thermoforming is a widely used process to produce plastic parts for various applications. The production is very cost-effective with regard to tooling and machinery costs, and achieves high output rates. To optimize the thermoforming process, computer simulations with finite-element methods (FEM) are carried out. However, it is a big problem in thermoforming that precise material data is not available and the estimation is a very expensive and time-consuming procedure. The target of this project, funded by the EEC, is to develop a low-cost measurement apparatus to measure material behavior and of fitting software for the precise characterization of thermoforming materials. It is aimed at an official test procedure which can also be used for quality assurance. With the measurement results, a data base will be developed for storing all relevant material data to be used for process optimization and for the design of new polymer products and tools. In cooperation with the Institute for Polymer Sciences IKP of the University of Stuttgart as a RTD performer, the SME proposes Wagner, ACCUFORM and the thermoformers Jacob and APT, intend to develop a measuring apparatus and fitting software for thermoforming material characterization.

K2001 review

Accuform, together with Compuplast International, Porpoise and CoreTech, took part in K-show at Duesseldorf, Germany. At one location, complete engineering solution for almost all kind of plastics processing was offered. Accuform, Compuplast, Porpoise and CoreTech form a world leading group of people on the measurement and use of rheology.

Accuform introduced new versions of software packages for simulation of blow molding (B-SIM) and thermoforming (T-SIM). Compuplast exhibited its suite FLOW2000 for extrusion simulation and extrusion die design. CoreTech, with Moldex software package, covered the area of injection molding simulation. Company Porpoise offered complete service in the field of rheology testing.