News

Events, exhibitions, conferences

 

New version of T-SIM V4.5a before release. Final testing under construction.

T-ForM "kick-off" meeting
Accuform is involved in T-ForM EU project. The "kick-off" meeting will be in Eindhoven, September 21-22, 2005.

The thermoforming process is at the present moment based on craftsmanship and an iterative trial and error approach. To improve the state of affairs of the European Thermoform industry (Employees: 275.000, Turnover: 27.5 Billion Euro) structurally and fight competition effectively, the T-ForM consortium is initiating this Collective Research project on a European level that will enable this industry to reduce throughput times and enable production First Time Right against lower costs. An integrated co-operation of design engineers, mould makers, thermoform specialists, software manufacturers supported by Research organizations, on a European level, is therefore a must.

For detailed information about the project, see www.t-form.org web site.

Thermoforming 2005 Spreading Our Wings September 24-27, 2005 Midwest Express Convention Center, Milwaukee, Wisconsin Visit our North America representative (company Compuplast) at exhibition. See also the official web site.

5th European Thermoforming Conference Salzburg Congress Auerspergstraße 6 A-5020 Salzburg / Austria Accuform will be there, exhibiting latest version of T-SIM. See also official web site.

Latest releases

1.11.2004 New versions of T-SIM and B-SIM were officially released. Existing users can download the new installation package in Support section.

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